De Fréijoer a Summer Saisons poséiert déi gréisste Erausfuerderunge fir Outdoor Leds Schrecken iwwer d'Joer, wéi déi fiichteg a waarmt Wieder direkt déi natierlech Kontradiktioun tëscht Feuchtigkeit- an Hëtzt Dissipéierung vu Led Screens. How to do a good job of moisture prevention in rainy weather while maintaining good heat dissipation in high temperature environments has become a thorny problem faced by outdoor LED displays.
1、 Moisture prevention and heat dissipation, a natural contradiction
The internal components of LED display screens belong to MSD components (humidity sensitive devices). Once moisture enters, it may cause oxidation and corrosion of components such as light beads, PCB boards, Muecht Ëmgeréits, and power cords, leading to dead light faults. Dofir, the module, internal structure, and external chassis of the LED screen need to be designed with comprehensive and rigorous moisture-proof and waterproof measures.
At the same time, the internal components of Vollfaarf Fett Schiirme are also the electronic components that generate the most heat, such as LED beads, driver ICs, switch power supplies, et cl. Poor heat dissipation design can cause oxidation of the screen material, affecting its quality and lifespan. If heat accumulates and cannot dissipate, it can cause internal components of the LED to overheat and damage, leading to malfunctions. Dofir, good heat dissipation requires a transparent and convective structure, which contradicts the requirement for moisture resistance.
2、 How to effectively prevent moisture and dissipate heat from LED display screens?
How to achieve a dual approach of high temperature and humidity
Entering the hot and humid weather, facing the seemingly irreconcilable contradiction between moisture prevention and heat dissipation, this can actually be cleverly resolved through exquisite hardware and meticulous structural design.
(1) Reducing power consumption and minimizing heat loss are effective ways to enhance heat dissipation capability. Lianjian Optoelectronics selects high-quality LED chips for optimized design from the source, focusing on the independent development of efficient and high-quality driving power supplies. The outstanding raw material quality and excellent performance parameters have laid a firm foundation for heat dissipation and moisture resistance.
(2) Improving the module production process is also of utmost importance. It is understood that the electronic components on the PCB board are structurally optimized, simplified and arranged reasonably, and sealed with high thermal conductivity materials, while meeting the seamless entry of water vapor and the heat dissipation requirements of the components.
(3) Reasonably optimizing the box structure can play a key role. Considering the heat dissipation and oxidation resistance of the chassis material, high-quality aluminum materials are selected. The chassis adopts a multi-layer spatial architecture to form an overall transparent and convective heat dissipation structure, which can fully utilize natural air for convective heat dissipation. This not only balances heat dissipation and sealing, but also improves reliability and service life
